surface mountable ptc resettable fuse page <1> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk specifications: applications : all high-density boards. product features : small surface mountable, solid state, faster time to trip than standard smd devices, lower resistance than standard smd devices. maximum voltage : 6v to 60v. temperature range : -40c to 85c. electrical characteristics (23c) hold current trip current rated voltage maximum current typical power maximum time to trip resistance part number current time r min r1 max i h, a i t, a v max, v dc i max, a p d, w amperes seconds ? ? ? ? 0.05 0.15 60 10 0.60 0.25 3.00 3.600 50.000 mc36203 0.10 0.25 60 10 0.60 0.50 1.50 1.600 15.000 mc36205 0.20 0.40 30 10 0.60 8.00 0.02 0.800 5.000 mc36208 0.35 0.70 16 40 0.60 8.00 0.20 0.320 1.300 mc36212 0.50 1.00 16 40 0.60 8.00 0.10 0.250 0.900 mc36214 0.75 1.50 8 40 0.60 8.00 0.10 0.130 0.400 MC36217 1.10 2.20 6 100 0.80 8.00 0.30 0.060 0.210 mc36223 1.50 3.00 6 100 0.80 8.00 0.50 0.040 0.110 mc36230 1.75 4.00 6 100 0.8 8.00 0.60 0.020 0.080 mc36236 2.00 4.00 6 100 0.8 8.00 1.00 0.015 0.070 mc36239 i h = hold current-maximum current at which the device will not trip at 23c still air. i t = trip current-minimum current at which the device will always trip at 23c still air. v max = maximum voltage device can withstand without damage at it rated current (i maximum). i max = maximum fault current device can withstand without damage at rated voltage (v maximum). p d = typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23c still air environment. r min = minimum device resistance at 23c prior to tripping. r1 max = maximum device resistance at 23c measured 1 hour after tripping or reflow soldering of 260c for 20 seconds. termination pad characteristics termination pad materials: pure tin. ul : e-345437
surface mountable ptc resettable fuse page <2> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk a b c d e figure part number minimum maximum minimum maximum minimum maximum minimum maximum minimum maximum 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 1 mc36203 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 1 mc36205 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 1 mc36208 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 1 mc36212 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 1 mc36214 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 1 MC36217 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45 2 mc36223 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45 2 mc36230 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 2 mc36236 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 2 mc36239 dimensions table ambient temperature (c) thermal derating curve thermal derating curve percent of rated hold and trip current dimensions : millimetres fsmd production dimensions (millimetre)
surface mountable ptc resettable fuse page <3> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk time-to-trip (s) fault current (a) a = mc36203 b = mc36205 c = mc36208 d = mc36212 e = mc36214 f = MC36217 g = mc36223 h = mc36230 i = mc36236 j = mc36239 typical time-to-trip at 23c material specification terminal pad material : pure tin. soldering characteristics : meets eia specification rs 186-9e, ansi/j-std-002 category 3. pad layouts solder reflow and rework recommendations the dimension in the table below provide the recommended pad layout for each 1210 device. device a nominal b nominal c nominal all 1210 series 2.00 1.00 2.80 pad dimensions dimensions : millimetres
surface mountable ptc resettable fuse page <4> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk solder reflow due to ?lead free? nature, temperature and dwelling time for the soldering zone is higher than those for regular. this may caus e damage to other components. 1. recommended max past thickness > 0.25mm. 2. devices can be cleaned using standard methods and aqueous solvent. 3. rework use standard industry practices. 4. storage environment : < 30c/60% rh. caution: 1. if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. devices are not designed to be wave soldered to the bottom side of the board. time temperature profile feature pb-free assembly average ramp-up rate (t s maximum to t p ) 3c/seconds maximum preheat: temperature minimum (t s minimum) temperature maximum (t s maximum) time (t s minimum to t s maximum) 150c 200c 60 -180 seconds time maintained above: temperature(t l ) time (t l ) 217c 60-150 seconds peak/classification temperature(t p ): 260c time within 5c of actual peak : temperature (t p ) 20-40 seconds ramp-down rate: 6c/seconds maximum time 25c to peak temperature: 8 minutes maximum note: 1all temperatures refer to of the package, measured on the package body surface. reflow profile
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